Oxygen-free ≥ 99.95%
Precision flattened profiles
High thermal conductance
< 1×10⁻⁹ mbar·l/s
High-temp degassing
CNC multi-axis forming
Samples from 10 pcs
High reliability testing
In ultra-compact, high-TDP electronic platforms, conventional solid copper heat spreaders (thermal conductivity ~385 W/m·K) create severe thermal bottlenecks. A sintered copper flat heat pipe cooling tube utilizes two-phase liquid-vapor transitions to yield equivalent thermal conductivities ranging between 5,000 W/m·K and 20,000 W/m·K depending on geometry, wick architecture, and working length.
Designed for space-constrained electronics such as thin laptops, handheld tablets, and ultra-dense 5G optical transceivers. Sintered powder maintains capillarity under narrow vapor cross-sections.
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The core configuration for graphics processing units, enterprise server heatsinks, and LED drivers. Balanced vapor volume and liquid return rate maximize maximum heat transport capacity (Qmax).
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Composite grooved-sintered wicks for automotive EV powertrain controllers, IGBT inverters, and industrial motor drives requiring up to 150W+ heat transfer per channel over anti-gravity paths.
Send an InquiryEvery copper flat heat pipe cooling tube manufactured by Shenzhen VUKO Electronics Co., Ltd. is dimensioned to prevent operational dry-out across varying thermal loads.
| Raw Envelope Material | C10200 Oxygen-Free High-Conductivity Copper (OFHC, ≥99.95%) |
|---|---|
| Working Liquid Medium | Ultra-pure double deionized water (Degassed, ≤0.1μS/cm conductivity) |
| Capillary Wick Matrix | High-porosity sintered spherical copper powder (45%–55% porosity) |
| Flattened Thickness Range | 0.40 mm to 4.00 mm (±0.05 mm precision tolerance) |
| Effective Width Range | 3.0 mm to 32.0 mm (Derived from round stock Φ3mm to Φ12mm) |
| Operational Temperature | -40°C to +150°C (Standard envelope limits) |
| Hermetic Seal Leak Rate | ≤ 1×10⁻⁹ mbar·l/s (Tested by Helium Mass Spectrometry) |
| Surface Treatment Options | Bright chemical pickling, anti-tarnish passivated, or electrolytic nickel plating |
A copper flat heat pipe cooling tube functions through a hermetically enclosed thermodynamic closed-loop cycle. When local thermal dissipation sources (such as an AI accelerator core, CPU, or high-power MOSFET) apply heat flux to the evaporator zone, the internal saturated water converts to vapor by absorbing latent heat of vaporization (ΔH_vap ≈ 2,260 kJ/kg). Due to pressure differences, this high-pressure vapor travels rapidly along the unobstructed central vapor chamber to the condenser zone. Here, heat is rejected into cooling fin arrays, cooling blocks, or cold plates. The condensed working fluid is then pumped back to the evaporator through capillary action provided by the sintered copper micro-porous matrix.
When selecting or specifying a copper flat heat pipe cooling tube, thermal engineers must balance space savings against the capillary limit. Flattening a cylindrical tube (e.g., from Φ6.0 mm down to 1.2 mm thickness) alters the hydraulic diameter of both the central vapor core and the sintered wick layer. As thickness decreases below 1.0 mm:
A frequent failure mode for industrial two-phase cooling devices is the gradual buildup of Non-Condensable Gases (NCG), typically molecular hydrogen. NCG is generated when residual water impurities or dissolved oxygen react with the copper wall over extended thermal cycles (Cu + H₂O → Cu₂O + H₂↑). The generated hydrogen gas is swept by the vapor stream into the condenser tip, where it forms an inert gas blanket. This reduces the effective condensing surface area, degrades heat pipe conductance, and leads to device overheating.
To eliminate this failure mechanism, Shenzhen VUKO Electronics Co., Ltd. implements a multi-stage manufacturing procedure:
Key technological, material, and geopolitical supply chain trends shaping two-phase thermal procurement for global enterprise and OEM buyers.
As mobile hardware, AI tablets, and ultra-portable computing profiles narrow, traditional round heat pipes flattened to 0.8mm are giving way to 0.4mm and 0.35mm composite flattened tubes. These offer vapor-chamber-like heat spread while maintaining the structural yield strength and routing flexibility of linear tubes.
Procurement managers are increasingly sourcing integrated cooling sub-assemblies rather than standalone pipes. Heat pipes are soldered or thermally bonded directly into Aluminum Metal Core PCBs (MCPCB), liquid cold plates, and extruded aluminum or copper fin stacks by a single vendor to reduce thermal interface resistance.
With automotive electronics, ADAS processing units, and high-reliability industrial IoT platforms migrating to two-phase cooling, qualification standards now demand rigorous thermal shock testing (-40°C to 125°C, >1000 cycles), multi-axis random vibration testing, and bursting pressure ratings above 3.0 MPa.
Combining precision thermal engineering with comprehensive electronics assembly to streamline supply chains and reduce integration risk.
Strategically situated in Shenzhen's hardware and manufacturing hub, Shenzhen VUKO Electronics Co., Ltd. bridges thermal management manufacturing and electronics assembly under a unified quality system. Instead of managing separate contracts for thermal design, metal stamping, PCB production, and SMT assembly, OEM customers benefit from coordinated turnkey execution.
Our engineering team performs Design for Manufacturability (DFM) reviews on all CAD submissions, identifying potential bending strain points, flattened wall thinning, and component interference issues prior to tooling fabrication.
A step-by-step overview of our quality control pipeline, from raw oxygen-free copper tube selection to final vacuum packaging.
Precision saw cutting & chemical deburring of C10200 tubing
Ultrasonic solvent washing & acid pickling to eliminate oxides
Mandrel insertion & high-temp hydrogen furnace sintering (>900°C)
Degassing to 10⁻⁴ Torr & sub-milligram fluid filling
Servo-controlled progressive compression down to target thickness
100% helium leak test, aging soak & Qmax parameter sign-off
Direct technical answers to common queries regarding two-phase phase change coolers, testing parameters, and custom production.
Flattening reduces the internal cross-sectional area of the vapor chamber and compresses the wick structure. For instance, flattening a standard 6.0mm round tube down to 2.0mm maintains roughly 80–90% of its initial Qmax. However, flattening down to 0.6mm or 0.4mm increases vapor shear stress and reduces vapor core volume, reducing maximum heat transport capacity from ~50W down to ~15W–18W. Shenzhen VUKO Electronics Co., Ltd. mitigates this trade-off by optimizing particle size distribution and sintering density to preserve fluid flow channels under high compression ratios.
Sintered copper powder wicks generate the highest capillary pressure, enabling reliable operation against gravitational forces (such as vertical orientations where the evaporator is positioned above the condenser). Grooved wicks provide lower capillary pumping pressure but offer minimal liquid flow resistance, performing well in horizontal setups. Mesh screen wicks provide a balance of moderate capillary force and ease of manufacturing. For flat profiles below 2.0mm thickness, sintered copper powder wicks generally provide the most stable thermal performance across varied device orientations.
Using high-purity deionized water as the working medium under vacuum, our standard copper flat heat pipes operate safely within an operating range of -40°C to +150°C. At sub-zero temperatures, the internal water freezes, and the pipe functions as a standard solid copper conductor until heat input melts the ice and restores two-phase operation. Freeze-thaw cycling stability is achieved by controlling fluid filling volume to accommodate volumetric expansion during solid-state phase transitions without bulging the oxygen-free copper wall.
Yes. We manufacture flat heat pipes with single or multiple continuous 2D/3D bends. The minimum bend radius typically scales at 3× the flattened pipe thickness. We provide DFM analysis, mockups, and cross-section validation to avoid wick cracking or internal delamination during secondary bending processes.
Non-condensable gases degrade heat pipe vacuum over time. We utilize ultra-high-grade C10200 oxygen-free copper (OFC), multi-stage ultrasonic chemical degreasing, high-temperature vacuum degas baking at over 400°C, and secondary deaeration pinching processes to guarantee zero NCG formation over a typical 100,000-hour service life.
To provide a detailed DFM review and pricing schedule, our engineers require your 3D CAD envelope (.STEP / .STP / .IGS), target mechanical constraints, heat source dimensions, maximum thermal design power (TDP/Qmax in Watts), anticipated ambient operational temperature range, and estimated annual procurement volumes.
Send your 3D mechanical models and heat dissipation requirements to Shenzhen VUKO Electronics Co., Ltd. Our thermal and manufacturing engineers provide comprehensive DFM feedback, Qmax validation, and quotation terms within 24 hours.
