Advanced Polyimide Substrates & Stiffener Integration
Flexible Printed Circuits (FPC) and Rigid-Flex PCBA eliminate heavy wire looms, bulky headers, and mechanical interconnection points. In coastal environments like Belize City, standard copper wire harnesses frequently suffer from capillary moisture ingress, galvanic corrosion, and terminal vibration loosening. By implementing DuPont Pyralux adhesiveless polyimide (PI) laminates, VUKO delivers flex circuit assemblies that resist continuous thermal shifts, chemical exposures, and salt fog oxidation.
Our flex SMT line utilizes specialized vacuum magnetic fixture pallets to secure flex substrates flat under high-speed Yamaha and Panasonic pick-and-place nozzles. This ensures micrometer-accurate solder paste deposition and zero thermal warpage across multi-zone reflow profiles.
- ✓ Adhesiveless Polyimide (12.5µm to 50µm)
- ✓ Rolled Annealed (RA) vs ED Copper
- ✓ Laser Cut FR4 & Polyimide Stiffeners
- ✓ Stainless Steel & Aluminum Heat Spreaders
- ✓ Electroless Nickel Immersion Gold (ENIG)
- ✓ 100% Automated Optical Inspection (AOI)
Inquire Now