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| Technical Parameter | Specification Details |
|---|---|
| Order Quantity | 1 - 500,000 |
| Layer | 1, 2, 4, 6, up to 24 layer |
| Material | FR-4, High Tg, Isola, Aluminum, Rogers, etc |
| PCB Type | Rigid, flexible, rigid-flexible |
| Shape | Rectangular, round, slots, cutouts, complex, irregular |
| Max PCB Dimensions | 1200mm * 600mm |
| Thickness | 0.2 ~ 4.0mm, Flex 0.01 ~ 0.25'' |
| Thickness Tolerance | ± 10% |
| Copper Thickness | 0.5 - 6 oz |
| Copper Thickness Tolerance | ± 0.25oz |
| Surface Finish | HASL, LF HASL, Imm Gold, Imm Silver, OSP etc |
| Solder Mask | Green, red, white, yellow, blue, black, orange, purple |
| Silk Screen | White, black |
| Silk Screen Min Line Width | 0.006'' or 0.15mm |
| Min Drill Hole Diameter | 0.01'', 0.1mm or 10 mil |
| Min Trace / Gap | 0.075mm or 3mil |
| PCB Cutting | Shear, V-score, tab-routed |
| Capability | Scope & Standards |
|---|---|
| PCBA | PCB + components sourcing + assembly + package |
| Assembly Details | SMT and Thru-hole, ISO SMT and DIP lines |
| Lead Time | Prototype: 15 work days. Mass order: 20~25 work days |
| Testing on Products | Testing jig/mold, X-ray Inspection, AOI Test, Functional test |
| Quantity | Min quantity: 1pcs. Prototype, small order, mass order, all OK |
| Files Needed | PCB: Gerber files (CAM, PCB, PCBDOC) Components: Bill of Materials (BOM list) Assembly: Pick-N-Place file |
| PCB Panel Size | Min size: 0.25 * 0.25 inches (6 * 6mm) Max size: 1200 * 600mm |
| Components Details | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
| Component Package | Cut Tape, Tube, Reels, Loose Parts |
| PCB + Assembly Process | Drilling → Exposure → Plating → Etching & Stripping → Punching → Electrical Testing → SMT → Wave Soldering → Assembling → ICT → Function Testing → Temperature & Humidity Testing |