High-reliability multilayer FR4 PCB engineered for automation and robotic controls. Features precision BGA pads and tight impedance tolerance.
Full reverse engineering service for legacy electronics. Extract Gerber, schematic netlists, and bill of materials from physical golden samples.
Cost-effective bare board fabrication designed for volume consumer electronics, smart home appliances, and microcontrollers.
Ruggedized printed circuit board built to handle high electrostatic discharge (ESD) and industrial environmental stress.
Optimized 4-to-12 layer stack-up configurations tailored for low noise, differential pair impedance control, and RF shielding.
Microvia technology and High-TG dielectric designed for compact smart devices, high-speed communication gear, and high computing cards.
Ultra-flat surface co-planarity suitable for 0201 chip components, fine-pitch QFNs, and dual-row interconnect sockets.
Fabricated in climate-controlled environments with stringent ionic contamination testing. Suitable for diagnostic and monitoring apparatus.
Supports 2 oz to 6 oz copper weight for power converters, audio subwoofers, motor drives, and industrial heating switches.
Combined polyimide flex circuit with rigid FR4 structural sections to eliminate wire harnesses and endure vibration.
Shenzhen VUKO Electronics Co., Ltd. operates state-of-the-art production lines adhering to IPC-A-600 / IPC-6012 standards. Compare parameters below for your engineering qualification.
| Parameter | Standard Capability | Advanced / High-Precision |
|---|---|---|
| Layer Count | 1 – 8 Layers | 10 – 32 Layers (HDI Blind/Buried Vias) |
| Base Material | FR4 (Shengyi, KB, Nanya) | High-TG (TG170/180), Rogers, Polyimide, Aluminum |
| Board Thickness | 0.4mm – 2.4mm | 0.2mm – 4.0mm (±10% tolerance) |
| Copper Thickness | 0.5 oz – 2.0 oz | 3.0 oz – 6.0 oz (Heavy Copper) |
| Min. Trace Width / Spacing | 3.5 mil / 3.5 mil (0.09mm) | 3.0 mil / 3.0 mil (0.075mm) |
| Min. Finished Hole Size | 0.20 mm (8 mil) | 0.15 mm (Laser Microvia: 0.10 mm) |
| Surface Finishes | HASL, Lead-free HASL, OSP | ENIG (Immersion Gold), ENEPIG, Hard Gold Finger |
| Solder Mask Colors | Green, Blue, Red, Black, White, Yellow | Matte Black, Matte Green, Clear Mask |
| Quality Assurance Testing | Flying Probe E-test, Visual Check | AOI, Dedicated Fixture E-Test, X-Ray BGA, Impedance TDR |
Shenzhen VUKO Electronics Co., Ltd. welcomes global OEM buyers for virtual audits and site visits. Traceable quality at every step.
Send your Gerber (RS-274X), BOM, and layer stack-up specs. Our engineering team at Shenzhen VUKO Electronics Co., Ltd. responds within 24 hours with a comprehensive DFM feedback report and pricing.